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Materials for advanced packaging [Elektronski vir]Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced ... Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineeringVrsta gradiva - e-knjigaZaložništvo in izdelava - New York ; London : Springer, 2008Jezik - angleškiISBN - 978-0-387-78219-5; 0-387-78219-2; 1-281-95426-8; 978-1-281-95426-8COBISS.SI-ID - 1541356511
Povezava(-e):
SpringerLink e-books 2008-2012Celotno besedilo dostopno za uporabnike SpringerLink slovenskega konzorcija neprofitnih institucij
Full text accessible to the users of SpringerLink Slovenian Consortium of Non-Profit Institutions
DOI
Drugi avtorji
Lu, Daniel |
Wong, C. P., 1947-
Teme
Packaging |
Materials |
Microelectronic packaging |
Microelectronic packaging |
Packaging |
Materials |
Science des matériaux |
Chimie |
Electronics and Microelectronics, Instrumentation |
Material Science |
Metallic Materials |
Optical and Electronic Materials |
TECHNOLOGY & ENGINEERING |
Electronics |
Microelectronics |
TECHNOLOGY & ENGINEERING |
Electronics |
Digital |
Electronic books
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