E-viri
Recenzirano
-
Alimonti, G.; Andreazza, A.; Bulgheroni, A.; Corda, G.; Di Gioia, S.; Fiorello, A.; Gemme, C.; Koziel, M.; Manca, F.; Meroni, C.; Nechaeva, P.; Paoloni, A.; Rossi, L.; Rovani, A.; Ruscino, E.
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 09/2006, Letnik: 565, Številka: 1Journal Article
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions.
