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Faculty of Mechanical Engineering, Lj. (FSLJ)
  • Investigation of structural and electrical properties of ▫$Al_2O_3/Al$▫ composites prepared by aerosol co-deposition [Elektronski vir]
    Regis de Moraes, Victor ...
    As the microelectronic industry develops, components that can perform several different tasks receive increasingly more attention, resulting in multifunctional materials being highly sought after. ... ▫$Al_2O_3$▫ is widely present in electronic applications as a protective coating or as an electrical and thermal insulator due to its mechanical and thermal stabilities and chemical inertness. ▫$Al_2O_3$▫ is also an important dielectric material, with high resistivity and stable permittivity over a wide range of temperatures and electric fields, but its modest permittivity necessitates large effective areas or extremely thin layers when a large capacitance is desired. Composites consisting of discrete conducting phases within an insulating matrix can produce large capacitance via Maxwell–Wagner polarization. In this work, ▫$Al_2O_3$▫/Al composite thick films with different volume ratios of Al were prepared using the aerosol deposition method. A relative dielectric permittivity (εr′) of 800 at 1 MHz was achieved at 27 vol% of Al, a sixty-sevenfold enhancement compared to ▫$Al_2O_3$▫. On the other hand, dielectric losses, tan(δ), at 1 MHz increased from 0.01 for ▫$Al_2O_3$▫ up to 0.58 for the composite with 27 vol% of Al. A finite-element model of the composites was implemented, supporting the nonlinear electrical behavior of the composites as function of vol% of Al. Our results show novel possibilities for the applications of ▫$Al_2O_3$▫-based materials in the microelectronic industry, especially for temperature-sensitive applications, for which the integration strengths of aerosol deposition are valuable.
    Source: Crystals [Elektronski vir]. - ISSN 2073-4352 (Vol. 13, iss. 5, May 2023, str. 1-12)
    Type of material - e-article ; adult, serious
    Publish date - 2023
    Language - english
    COBISS.SI-ID - 152943619

    Link(s):

    https://www.mdpi.com/2073-4352/13/5/850
    Repository of the University of Ljubljana – RUL
    DOI

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