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  • Anomalously low electronic ... Anomalously low electronic thermal conductivity in metallic vanadium dioxide
    Lee, Sangwook; Hippalgaonkar, Kedar; Yang, Fan ... Science (American Association for the Advancement of Science), 01/2017, Volume: 355, Issue: 6323
    Journal Article
    Peer reviewed
    Open access

    In electrically conductive solids, the Wiedemann-Franz law requires the electronic contribution to thermal conductivity to be proportional to electrical conductivity. Violations of the ...
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  • The effect of non-analytica... The effect of non-analytical corrections on the phononic thermal transport in InX (X = S, Se, Te) monolayers
    Shafique, Aamir; Shin, Young-Han Scientific reports, 01/2020, Volume: 10, Issue: 1
    Journal Article
    Peer reviewed
    Open access

    We investigate the effect of non-analytical corrections on the phonon thermal transport properties in two-dimensional indium chalcogenide compounds. The longitudinal optical (LO) and transverse ...
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  • Enhancement of Thermoelectr... Enhancement of Thermoelectric Properties of PEDOT:PSS and Tellurium-PEDOT:PSS Hybrid Composites by Simple Chemical Treatment
    Bae, Eun Jin; Kang, Young Hun; Jang, Kwang-Suk ... Scientific reports, 01/2016, Volume: 6, Issue: 1
    Journal Article
    Peer reviewed
    Open access

    The thermoelectric properties of poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) ( PSS) and tellurium- PSS (Te- PSS) hybrid composites were enhanced via simple chemical treatment. The ...
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  • Concerted Rattling in CsAg5... Concerted Rattling in CsAg5Te3 Leading to Ultralow Thermal Conductivity and High Thermoelectric Performance
    Lin, Hua; Tan, Gangjian; Shen, Jin-Ni ... Angewandte Chemie (International ed.), September 12, 2016, Volume: 55, Issue: 38
    Journal Article
    Peer reviewed
    Open access

    Thermoelectric (TE) materials convert heat energy directly into electricity, and introducing new materials with high conversion efficiency is a great challenge because of the rare combination of ...
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  • Strained endotaxial nanostr... Strained endotaxial nanostructures with high thermoelectric figure of merit
    Biswas, Kanishka; He, Jiaqing; Zhang, Qichun ... Nature chemistry, 02/2011, Volume: 3, Issue: 2
    Journal Article
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    Thermoelectric materials can directly generate electrical power from waste heat but the challenge is in designing efficient, stable and inexpensive systems. Nanostructuring in bulk materials ...
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  • Effective transference numb... Effective transference numbers and water incorporation in glassaceramic La(PO3)3aCa(PO3)2 in oxidizing atmospheres
    Zhang, Guojing; Yu, Rong; De Jonghe, Lutgard C Solid state ionics, 06/2012, Volume: 217
    Journal Article
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    La(PO3)3aCa(PO3)2 meta-phosphate glassaceramic composites were prepared by quenching from the melt, followed by heating at 800 degC for 20 h, in air. Microstructural characterization showed that ...
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  • Copper ion liquid-like ther... Copper ion liquid-like thermoelectrics
    Liu, Huili; Shi, Xun; Xu, Fangfang ... Nature materials, 2012-Mar-11, Volume: 11, Issue: 5
    Journal Article
    Peer reviewed

    Advanced thermoelectric technology offers a potential for converting waste industrial heat into useful electricity, and an emission-free method for solid state cooling. Worldwide efforts to find ...
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  • Ultralow thermal conductivi... Ultralow thermal conductivity and high thermoelectric figure of merit in SnSe crystals
    Zhao, Li-Dong; Lo, Shih-Han; Zhang, Yongsheng ... Nature (London), 04/2014, Volume: 508, Issue: 7496
    Journal Article
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    The thermoelectric effect enables direct and reversible conversion between thermal and electrical energy, and provides a viable route for power generation from waste heat. The efficiency of ...
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  • Soft and Self‐Adhesive Ther... Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling
    Yan, Qingwei; Alam, Fakhr E.; Gao, Jingyao ... Advanced functional materials, 09/2021, Volume: 31, Issue: 36
    Journal Article
    Peer reviewed

    Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials ...
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