Airflow in wall-to-wall junctions is known to have a major hygrothermal impact on building performance. However, current and validated modeling options to simulate such phenomena are limited. This paper develops and compares two numerical models to study the heat and moisture transfer due to air infiltrations through a prefabricated wall-to-wall junction. The first model explicitly accounts for the airflow with a pipe flow approach. The second model is a modification to a typical approach to simulate ventilated cavities in building envelope simulation tools and mimics the effect of the airflow through source terms. Both approaches were introduced in a heat and moisture transfer 2D finite element model. Additionally, laboratory measurements were conducted in a climatic chamber to validate the simulation results. Six scenarios were tested experimentally under steady-state conditions. These datasets were used to calibrate different parameters of the models, such as material properties, the junction air gap thickness, and the magnitude of the heat and moisture source terms. Both sets of numerical results provided reasonable agreement with the measurements. The first approach outputs more accurate temperature and relative humidity values than the second one. However, considering uncertainties, no method predicted a perfect fit with the relative humidity profiles. Close to the junction, the first method estimates better the relative humidity than the second one. This work provides guidelines to better model and account for wall junctions in building envelope simulators. •Airflow in wall junctions impacts hygrothermal performance, but is hard to model.•Temperature and humidity results from 2 models are compared to experimental results.•Pipe flow model better predicts temperature measurements than source term model.•Both models exhibited differences in relative humidity compared to measurements.