Low Temperature Curable Polyimide for Advanced Package

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Low Temperature Curable Polyimide for Advanced Package

Sasaki, Takahiro

Journal of Photopolymer Science and Technology, 01/2016, Volume: 29, Issue: 3

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Advanced packaging technology requires low temperature curable and low residual stress material as dielectric layer. We developed appropriate product based on our previous study and so on. As a result, we used polyimide structure with acidity control of amine unit techniques for polymer and additive A for copper adhesive. And we also evaluated the product regarding various items.

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Sasaki, Takahiro

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