Buried Layer Low Gain Avalanche Diodes Apresyan, A.; Giacomini, G.; Heller, R. ...
Journal of physics. Conference series,
11/2022, Letnik:
2374, Številka:
1
Journal Article
Recenzirano
Odprti dostop
We report on the design, simulation and test of Low Gain Avalanche Diodes (LGADs) which utilize a buried gain layer. The buried layer is formed by patterned implantation of a 50-micron thick float ...zone substrate wafer-bonded to a low resistivity carrier. This is then followed by epitaxial deposition of a ≈ 3 micron-thick high resistivity amplification region. The topside is then processed with junction edge termination and guard ring structures and incorporates an AC-coupled cathode implant. This design allows for independent adjustment of gain layer depth and density, increasing design flexibility. A higher gain layer dopant density can also be achieved by controlling the process thermal budget, improving radiation hardness. A first set of demonstration devices has been fabricated, including a variety of test structures. We report on TCAD design and simulation, fabrication process flow, and preliminary measurements of prototype devices.
Fast timing with induced current detectors Lipton, Ronald; Theiman, Jason
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
11/2019, Letnik:
945, Številka:
C
Journal Article
Recenzirano
Odprti dostop
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex ...circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. We describe the capabilities of such a system and the limitations imposed by geometry and power. We describe how a similar geometry can be used to provide very fast timing of x-ray arrival in a thick sensor by utilizing the transient induced current in a field of pixels.
The application of vertically integrated (3D) electronics to particle physics has been explored by the our group for the past several years. We have successfully designed the first vertically ...integrated demonstrator chip for ILC vertex detection in the three-tier MIT-Lincoln Labs process. We have also studied sensor integration with electronics through oxide bonding and silicon-on-insulator technology. This paper will discuss the status of these studies and prospects for future work.
B Baryon Spectroscopy at D0 Lipton, Ronald
Nuclear physics. A,
08/2009, Letnik:
827, Številka:
1
Journal Article
Recenzirano
We report on the observation of the
Ω
b
−
and
Ξ
b
−
baryons with the D0 detector at the Fermilab Tevatron. The
Ξ
b
−
was observed in the decay mode
Ξ
b
−
→
J
/
Ψ
Ξ
−
with a mass of
5.774
±
0.011
±
...0.015
GeV/c
2
. The
Ω
b
−
was observed in the analogous decay mode
Ω
b
−
→
J
/
Ψ
Ω
−
with a mass of
6.165
±
0.010
±
0.014
GeV/c
2
.
Fully 3-D Integrated Pixel Detectors for X-Rays Deptuch, Grzegorz W.; Carini, Gabriella; Enquist, Paul ...
IEEE transactions on electron devices,
01/2016, Letnik:
63, Številka:
1
Journal Article
Recenzirano
Odprti dostop
The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit ...board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter throughsilicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn-Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. A successful completion of the 3-D integration is reported. In addition, all pixels in the matrix of 64 x 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e - rms and a conversion gain of 69.5 μV/e with 2.6 e - rms and 2.7 μV/e rms pixel-to-pixel variations, respectively, were measured.
Fully 3D-Integrated Pixel Detectors for X-Rays Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul ...
IEEE transactions on electron devices,
01/2016, Letnik:
63, Številka:
1
Journal Article
Recenzirano
Odprti dostop
The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit ...board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.
The VIPIC1 readout integrated circuit was designed for X-ray Photon Correlation Spectroscopy experiments that are typically performed using mono-energetic (8 keV) X-rays at a synchrotron radiation ...facility. The device is a pixel detector with sparsification and parallel readout from the groups, yielding high timing resolution. Recent improvements in bonding alignment of wafers resulted in deliveries of 3D bonded wafers. The stacks, bonded with both the Cu-Cu thermo-compression method and the Cu DBI bonding method, yielded operational devices that have been tested. Chips (with a pixel pitch of 80 μm) were also bonded to silicon pixelated sensors (with a pixel pitch of 100 μm) and the assemblies were exposed to X-ray sources for the first time. The paper focuses on the test results, including the calibrated noise (ENC) and the conversion gain. The noise measured corresponded to 39 e - and 70 e - , respectively for the readout channels that were not connected and connected to the sensor diodes. The conversion gain varied from 43 to 52 μV/e - as a function of the bias current in the front-end block. Essentially all the pixels on a small prototype were operational.
Vertically Integrated Circuits at Fermilab Deptuch, G W; Demarteau, M; Hoff, J R ...
IEEE transactions on nuclear science,
08/2010, Letnik:
57, Številka:
4
Journal Article
Recenzirano
Odprti dostop
The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities ...that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.
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