MALTA monolithic pixel sensors in TowerJazz 180 nm technology Solans Sánchez, C.; Allport, P.; Asensi Tortajada, I. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
12/2023, Letnik:
1057
Journal Article
Recenzirano
Odprti dostop
Depleted Monolithic Active Pixel Sensors are of highest interest at the HL-LHC and beyond for the replacement of the Pixel trackers in the outermost layers of experiments where the requirement on ...total area and cost effectiveness is much bigger. They aim to provide high granularity and low material budget over large surfaces with ease of integration. Our research focuses on MALTA, a radiation hard DMAPS with small collection electrode designed in TowerJazz 180 nm CMOS imaging technology and asynchronous read-out. Latest prototypes are radiation hard up to 2 × 1015 1 MeV neq/cm2 with a time resolution better than 2 ns.
MALTA is a depleted monolithic active pixel sensor (DMAPS) developed in the Tower Semiconductor 180-nm CMOS imaging process. Monolithic CMOS sensors offer advantages over current hybrid imaging ...sensors in terms of both increased tracking performance due to lower material budget and ease of integration and construction costs due to the integration of read-out and active sensor into one ASIC. Current research and development efforts are aimed toward radiation hard designs up to 100 Mrad in total ionizing dose (TID) and <inline-formula> <tex-math notation="LaTeX">1\,\, \times 10 ^{15}~1~\text {MeV}\text {n}_{\text {eq}}/\text {cm}^{2} </tex-math></inline-formula> in nonionizing energy loss (NIEL). The design of the MALTA sensors was specifically chosen to achieve radiation hardness up to these requirements and satisfy current and future collider constraints. The current MALTA pixel architecture uses small electrodes which provide less noise, higher signal voltage, and a better power-to-performance ratio. To counteract the loss of efficiency in pixel corners, modifications to the Tower process have been implemented. The MALTA sensors have been tested during the 2021 and 2022 SPS CERN Test Beam in the MALTA telescope. The telescope ran for the whole duration of the beam time and took data to characterize the novel MALTA2 variant and the performance of irradiated samples in terms of efficiency and cluster size. These campaigns show that MALTA is an interesting prospect for HL-LHC and beyond collider experiments, providing both very good tracking capabilities and radiation hardness in harsh radiation environments.
Quad-module characterization with the MALTA monolithic pixel chip Dachs, F.; Zoubir, A.M.; Sharma, A. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
07/2024, Letnik:
1064
Journal Article
Recenzirano
The MALTA silicon pixel detector combines a depleted monolithic active pixel sensor (DMAPS) with a fully asynchronous front-end and readout. It features a high granularity pixel matrix with a 36.4 μm ...symmetric pixel pitch, low power consumption of <1 μW/pixel and low material budget with detector thicknesses as little as 50 μm. It achieves a radiation hardness to 100MRad TID and more than 1 × 10E15 1 MeV neq/cm2 with a time resolution of <2 ns (Pernegger et al., 2023).
In order to cover large sensitive areas efficiently with a minimum of power and data connections the development of modules, comprising of up to 4 MALTA detectors, is studied.
This contribution presents the beam test performance of parallel and serial powered MALTA 4-chip modules in an effort to characterize the sensor’s chip-to-chip data and power transmission and prepare the production of a first prototype of an ultra-light weight 4-chip module on a flexible circuit with next generation MALTA2 sensors.
MALTA2 is a depleted monolithic active pixel sensor (DMAPS) developed in the Tower 180 nm CMOS imaging process. Monolithic CMOS sensors offer advantages over current hybrid imaging sensors both in ...terms of increased tracking performance due to lower material budget but also in terms of ease of integration and construction costs due to the monolithic design. Current research and development efforts are aimed towards radiation-hard designs up to 100 Mrad in Total Ionizing Dose and 3×1015 1 MeV neq/cm2 in Non-Ionizing Energy Loss. One important property of a sensor’s radiation hardness is the depletion depth at which efficient charge collection is achieved via drift movement. Grazing angle test-beam data was taken during the 2023 SPS CERN test beam with the MALTA telescope and Edge Transient Current Technique studies were performed at DESY in order to develop a quantitative study of the depletion depth for un-irradiated, epitaxial MALTA2 samples. The study is planned to be extended for irradiated and Czochralski MALTA2 samples.
In this article, a low-power, radiation-hard front-end circuit for monolithic pixel sensors, designed to meet the requirements of low noise and low pixel-to-pixel variability, the key features to ...achieve high detection efficiencies, is presented. The sensor features a small collection electrode to achieve a small capacitance (<5 fF) and allows full CMOS in-pixel circuitry. The circuit is implemented in the 180-nm CMOS imaging technology from the TowerJazz foundry and integrated into the MALTA2 chip, which is part of a development that targets the specifications of the outer pixel layer of the ATLAS Inner Tracker upgrade at the LHC. One of the main challenges for monolithic sensors is a radiation hardness up to 10 15 1-MeV <inline-formula> <tex-math notation="LaTeX">\text {n}_{\text {eq}}/\text {cm}^{{2}} </tex-math></inline-formula> non-ionizing energy loss (NIEL) and 80 Mrad total ionizing dose (TID) required for this application. Tests up to <inline-formula> <tex-math notation="LaTeX">{3} \cdot {10}^{15} </tex-math></inline-formula> 1-MeV <inline-formula> <tex-math notation="LaTeX">\text {n}_{\text {eq}}/\text {cm}^{{2}} </tex-math></inline-formula> and 100 Mrad were performed on the MALTA2 sensor and front-end circuit, which still show good performance even after these levels of irradiation, promising for even more demanding applications such as the future experiments at the high-luminosity large hadron collider (HL-LHC).
The MALTA pixel chip is a 2 cm × 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow ...chip-to-chip data transfer. The power pads are located mainly at the side edges on the chip which allows for chip-to-chip power transmission. The MALTA chip has been used to study module assembly using different interconnection techniques to transmit data and power from chip to chip and to minimize the overall material budget. Several 2-chip and 4-chip modules have been assembled using standard wire bonding, ACF (Anisotropic Conductive Films) and laser reflow interconnection techniques. These proceedings will summarize the experience with the different interconnection techniques and performance tests of MALTA modules with 2 and 4 chips tested in a cosmic muon telescope. They will also show first results on the effect of serial power tests on chip performance as well as the impact of the different interconnection techniques and the results of mechanical tests. Finally, a conceptual study for a flex based ultra-light weight monolithic pixel module based on the MALTA chip with minimum interconnections is presented.
The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker ...requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 {\mu}m trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.
