In an electric vehicle (EV), thermal runaway, vibration or vehicle impact can lead to a potential failure of lithium-ion (Li-ion) battery packs due to their high sensitivity to ambient temperature, ...pressure and dynamic mechanical loads. Amongst several factors, safety and reliability of battery packs present the highest challenges to large scale electrification of public and private transportation sectors. This paper reviews mechanical design features that can address these issues. More than 75 sources including scientific and technical literature and particularly 43 US Patents are studied. The study illustrates through examples that simple mechanical features can be integrated into battery packaging design to minimise the probability of failure and mitigate the aforementioned safety risks. Furthermore, the key components of a robust battery pack have been closely studied and the materials have been identified to design these components and to meet their functional requirements. Strategic battery pack placement technique is also discussed using an example of Nissan LEAF battery packaging design. Finally, the disclosed design solutions described in this paper are compared with the Chevrolet Volt battery pack design to reveal the basic mechanical design requirements for a robust and reliable battery packaging system.
•Anthropomorphism can be a helpful tactic for promoting insect foods.•Psychological closeness mediates the anthropomorphic effect on purchase intention.•Food neophobia moderates the anthropomorphic ...effect on purchase intention.
There is growing academic and practical interest in entomophagy as a viable and sustainable solution to the environmental problems of conventional livestock production and future food crises. Although researchers are examining how to effectively increase consumer acceptance of insect food, the existing findings of relevant studies are limited. This study examined whether and how anthropomorphism, one of the most widely used marketing tactics for product promotions, affects consumers’ purchase intentions for insect foods. The results of these two studies demonstrate that anthropomorphic packaging can increase consumers’ purchase intentions for insect foods. Moreover, the effect of anthropomorphism on purchase intention was mediated by perceived psychological closeness to insect food. Our study demonstrates the moderating effect of food neophobia. Specifically, when an individual has a high food neophobia score, the effect of psychological closeness on purchase intention is weakened. This study is the first to demonstrate that anthropomorphic packaging can be a desirable tactic to increase consumers’ purchase intentions for insect foods, and reveals how and when the tactic is effective in promoting these foods.
In this study, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2-D, 2.1-D, 2.3-D, 2.5-D, ...and 3-D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-count, and metal linewidth and spacing for advanced packaging, are examined. The lateral communication between chiplets, such as the silicon bridges embedded in organic build-up package substrate and fan-out epoxy molding compound, as well as flexible bridges, will be presented. Fan-in packaging, such as the six-side molded wafer-level chip-scale package (WLCSP) and its comparison with the ordinary WLCSP, are presented. Fan-out packaging, such as the chip-first with die face-up, chip-first with die face-down, and chip-last and their difference, will be provided. Low-loss dielectric materials for high-speed and high-frequency applications in advanced packaging will be presented. Flip-chip assembly by mass reflow, thermocompression bonding, and bumpless hybrid bonding will be briefly mentioned first.
Packaging design, as an important element in product appearance, can directly affect customers' sensory perception of the product. Many universities even offer packaging design majors, which mainly ...use natural science and aesthetic knowledge to promote product sales. However, many old brands remain complacent and their packaging design still adopts traditional thinking, which to some extent affects their sales. Therefore, this article decided to use genetic algorithms as a tool to parameterize the 3D fractal images in packaging design, aiming to create more creative and eye-catching packaging designs. At the end of this article, an experiment was conducted on two branches of a certain brand. Branch 1 tried out the new design provided in this article, while Branch 2 continued to use the original design. After Branch 1 fully adopted the design, sales skyrocketed, from the original daily sales of 50-60 units to 70-85 units. Branch 2 remained unchanged, with a sharp contrast.
Abstract The 3-D heterogeneous integration technology of microsystem is the best technical means to achieve higher integration, higher performance and higher working frequency of radio frequency (RF) ...electronic system. RF microsystem integration technology is categorized into three main types based on the packaging substrate: silicon-based, ceramic-based, and resin-based. In this work, the principle of RF microsystem integration technology is demonstrated in detail, and the process routes and characteristics of different packaging structures are clarified. Moreover, through the multi-dimensional comparison of different packaging structures, the application conditions of specific packaging structures are obtained. According to the comprehensive evaluation, the resin-based embedded chip package shows outstanding potentials in RF performance, integration capability, batch production capability and process cost. However, there are three shortcomings that limit its application in RF microsystems: Firstly, in terms of the universality of RF chips, metal grounding on the back of RF chips cannot be realized by this packaging, and special design of RF chips is required. At present, however, the universal chip with gold back grounding on the market cannot meet the requirements of the packaging process. Secondly, because of the high cost of customized chips, this packaging process is not suitable for small-scale production. Thirdly, the resin-based package does not have the sealing function, thus reliability of the product still needs to be verified. Ceramic-based RF microsystems do not require customized chips and have advantages in chip versatility compared to resin-based systems, with integration capabilities comparable to resin-based systems. However, its batch production capacity is much lower than resin based. In contrast, the silicon-based embedded chip package is as excellent as the resin-based products in chip versatility, RF performance, integration capability, batch production capability, etc., except that the manufacturing cost is high, and the yield should be effectively guaranteed in the manufacturing process. The conclusion provides a guidance for the future research of RF microsystem integration technology.
An overview of microelectromechanical systems (MEMS) resonators for frequency reference and timing applications is presented. The progress made in the past few decades in design, modeling, ...fabrication and packaging of MEMS resonators is summarized. In particular, the state-of-the-art technologies for improving the overall performance of MEMS resonators, such as quality factor (<inline-formula> <tex-math notation="LaTeX">Q </tex-math></inline-formula>), motional impedance, temperature sensitivity, and initial frequency uniformity, are reviewed in detail. The challenges and opportunities during the commercialization of MEMS resonators are also stated, and future development trends driven either by technology or market are outlined. This paper intends to provide an outlook for possible research directions of MEMS resonators in frequency reference and timing applications. With outstanding reliability, unique multi-frequency functionality on a single chip, and high accuracy, MEMS resonators show great potential for replacing the quartz crystal resonators which have been dominating the timing market since 1920s. 2020-0106
•We conducted an eye-tracking study to test how packaging color affected label search.•Finding a color-flavor incongruent packaging was slower than a congruent one.•Eye-tracking data showed ...participants initially relied on color in label search.•Our findings manifest the importance of crossmodal congruency in packaging design.•Color-flavor incongruent packaging design may be used to attract attention.
Consumers tend to associate stimuli across different senses, such as the color and flavor of foods or drinks. After repeated exposure to the packaging of mainstream food products, consumers can even associate a certain packaging color and a given flavor label. Previous research has demonstrated the influence of these packaging color-flavor label associations on the visual search for a certain flavor label. Here we report an eye-tracking study designed to investigate the mechanisms of this behavioral effect. The participants were cued by a flavor word before they searched for a food packaging with this flavor label. The behavioral results revealed that they were slower to find a color-flavor incongruent target than a color-flavor congruent one, indicative of a color-flavor incongruency effect. The eye-movement results suggested that the participants might rely on color when searching for a packaging labeled with a certain flavor, and switch back to word-based search if the target was not found via color-based search. These findings demonstrate the importance of color-flavor congruency in packaging design, and shed some light on how to use color-flavor incongruency in packaging design for new flavors to attract consumers’ attention in-store or online.
Since two decades piezoelectric MEMS resonator research has been making a headway by leaps and bounds in multiple fronts such as micro/nanofabrication techniques, device and system design, monolithic ...integration, packaging, material engineering, etc. Piezoelectricity based frequency selective resonant tanks are an integral part of radio frequency communication, inertial sensors, infrared sensors, environmental monitoring modules, energy harvesters, etc. To improve the functionality of the aforementioned modules it is cardinal to understand the underlying concepts of resonator design, material selection, and performance enhancement techniques. Here in this review paper, a comprehensive overview of various piezoelectric thin-film material properties along with different commercial microfabrication platforms with CMOS integration facility is presented. The device characteristics greatly depend on the resonator mode shape and thus suitable modes and thin-film material configurations can be chosen depending on the target frequency, application, and power budget requirements. In addition to device modeling, a synopsis of the several acoustic and material engineering approaches to enhance the figure of merit of the resonator has been presented. The future avenues of piezoelectric MEMS cover a wide spectrum of possibilities such as 5G communication, quantum processing, frequency combs, photonics integration, gesture sensors, etc.
Abstract
With the progress of science and technology, chip integration and packaging density continue to improve, and the power density increases rapidly, leading to the increasingly prominent ...problem of chip heat dissipation. The service environment of industrial chips with a wide temperature range is even worse, so it is necessary to ensure reliable operation in the environment of −40°C~85°C. The thermal design and thermal management of packaging have become an important problem in the industry. Based on the wide temperature range of high-power WB-BGA industrial chips, aiming at the difficulty of chip heat dissipation in the high-temperature environment of 85°C, this paper studies and optimizes the packaging heat dissipation, and proposes a high heat dissipation packaging design scheme based on the wide temperature-range high-power WB-BGA industrial chip, which reduces the chip junction temperature by 17.9°C and has a certain reference value for the packaging design of wide temperature range industrial chip.
