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  • Electrochemical formation of laminar of deposits of controlled structure and composition. Part 2 : dual current pulse galvanostatic tecnique
    Despić, A. R. ; Jović, V. D. ; Spaić, Savo
    A dual current pulse technique was developed for plating two layers of different metals, or any number of pairs of layers, from a single bath. The key condition is to maintain the current density ... from the first current pulse below the diffusion limiting current density of discharge of the more noble metal and that from the second pulse well above the former and below the limiting current density of deposition of the less noble metal. If the content of the first metal in the second layer is to be small, the concentration of its ions in solution must be much smaller than that of the ions of the second metal. Example of plating several layers of copper and nickel upon each other is given.
    Vir: Journal of the Electrochemical Society. - ISSN 0013-4651 (Vol .136, no. 6, 1989, Str. 1651-1657)
    Vrsta gradiva - članek, sestavni del ; neleposlovje za odrasle
    Leto - 1989
    Jezik - angleški
    COBISS.SI-ID - 149343

vir: Journal of the Electrochemical Society. - ISSN 0013-4651 (Vol .136, no. 6, 1989, Str. 1651-1657)

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