Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a <inline-formula> <tex-math notation="LaTeX">64 \times 32 </tex-math></inline-formula> array inline structure of a micro-LED (<inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>LED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>LED was <inline-formula> <tex-math notation="LaTeX">100\,\,\mu \text{m}\,\,\times 100\,\,\mu \text{m} </tex-math></inline-formula>. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>LED display. Au-In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75%.