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  • Moisture patterns and fluxe...
    Mareš, Jakub; Bruthans, Jiří; Studencová, Alžběta; Filippi, Michal

    Earth surface processes and landforms, 07/2024
    Journal Article

    Abstract Cavernous weathering forms have long been studied and discussed as enigmas in geomorphology. Recently, their evolution has been shown to be controlled by moisture patterns, which are still poorly understood. For the first time, capillary water and vapor fluxes were characterized in detail at tafone in a temperate climate of central Europe using a wide range of methods adapted from soil hydrology. Time domain reflectometry showed that moisture flows from the rock interior to the evaporation front in the shallow subsurface of both — the backwalls and the outer surface. When overland flow occurs on the outer surfaces (after heavy rains), 10 mm/day can infiltrate and flow toward the backwalls. The main sources of water for tafone are the influx of water from the rock interior and the infiltration of overland flow after heavy rains, while condensation of air humidity is a minor source. Influx from the rock interior is coupled to the evaporation rate, which varies between 100 and 300 kg/m 2 /year in summer and less than 15 kg/m 2 /year in winter. More water evaporates from the backwall of the tafone than from the outer surface, and more salt is deposited in the backwalls, resulting in predominant salt weathering in the backwalls. The tafoni studied thus evolve, and the cavities deepen. Tafoni in arid and semi‐arid environments generally show a much higher contrast between evaporation rates from backwalls and outer surfaces than tafoni and honeycombs in temperate and coastal environments. Tafoni in temperate settings are therefore more susceptible to degradation when evaporation decreases or inflow to the tafone increases. This study also shows that microtensiometers can be used to determine moisture content with high spatial resolution, while time domain reflectometry allows accurate characterization of moisture patterns with depth.