The heat affected zone liquation cracking behavior was studied in laser additive manufactured Inconel 718. Liquation cracking was found initiating from the weak site near the fusion line in the pre-deposited layer, propagating along the interdendritic region with the further deposition proceeding layer by layer. Total cracking length calculation results showed that when controlling the heat input and height increment constant, liquation cracking susceptibility increased with the increase of laser scanning speed; and when controlling the laser scanning speed and height increment constant, liquation cracking susceptibility increased with the increase of heat input. The effect of grain boundary misorientation on susceptibility to liquation cracking was also investigated through electron backscatter diffraction (EBSD) measurement, and the results showed that liquation cracking tendency increased with the increase of grain boundary angle, which was considered to be attributed to the higher stability of liquation film at larger grain boundary during the last stage of solidification. Display omitted •Liquation cracking propagates with the following deposition layer by layer.•The low interdendritic bridging reduces cracking resistance during solidification.•Liquation film stability is increased due to the improved heat accumulation.•Liquation cracking increases with increasing laser scanning speed and heat input.•Liquation cracking increases with the increase of grain boundary misorientation.