The demand for crystalline silicon wafers is continuing to increase. It is inevitable that high-purity silicon will be lost as loose abrasive slurry silicon powder (LASSP) and diamond wire saw silicon powder (DWSSP) during the process of wafer preparation. For this reason, some advanced processes or methods require further development to solve the problems of the high production cost, silicon wafer shortage, and environmental pollution caused by these silicon resources. Some processes and technologies for silicon recovery and purification from LASSP and DWSSP are comprehensively reviewed in this paper. These investigations inform some anticipated technological trends and required improvements, and encourage the development of technological solutions. Furthermore, the authors propose that high-purity silicon for industrial implementations can be recycled from LASSP and DWSSP via a combined process of an acid leaching pretreatment and a high-temperature treatment. Additionally, some existing deficiencies and areas that require enhancement are also proposed for improved impurity removal and silicon recovery with a higher process efficiency.