Monitoring bond strength development during the phenol-formaldehyde adhesive cure
Šernek, Milan ; Jošt, Matej, lesar
The influence of press temperature on the development of the shear strength of the phenol-formaldehyde (PF) adhesive bond during curing was investigated. A commercial plywood PF adhesive and 1.1 mm ...thick peeled beech (Fagus sylvatica L.) veneer were used to produce lap-shear specimens, which were cured at four pressing temperatures, ranging between 140 and 200 °C. Shear test (ST) using principles of automated bonding evaluation system (ABES) and dielectric analysis (DEA) were used to evaluate the mechanical and physical-chemical aspect of PF adhesive cure in a miniature hydraulic hot-press. It was found that press temperature influenced the shear strength development and the degree of cure of the PF adhesive bond. The higher press temperatures induced a faster temperature rise in the PF adhesive bond, and thus accelerated the chemical conversion of the adhesive as well as the development of the adhesive bond strength. The process of bond strength development can be adequately described by a logistic growth model. The bond strength development of PF adhesive was in correlation with the degree of cure, which can be described by an empirical power equation derived from the data.
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