61.	CMP of polyimide for low-k dielectric application in ULSI Ya-Li Tai; Bau-Tong Dai; Ming-Shih Tsai ... 1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453), 1999 Conference Proceeding Polyimide CMP is investigated for its feasibility in IMD planarization applications. The polish rates of polyimide are found to be heavily dependent upon the degree of imidization and hydroxyl ...	Full text Entire journal
62.	Planarizing dielectrics for VLSI technology Chi-Wen Liu; Bau-Tong Dai; Ching-Fa Yeh ... International Electron Devices and Materials Symposium, 1994 Conference Proceeding In this paper we describe the first reported blanket removal properties of various dielectric films. Based on material selectivity, We deposited thin PEOX, thick BPSG and a hard dielectric film with ...	Full text Entire journal
63.	Novel 140°C hybrid thin film solar cell/transistor technology with 9.6% conversion efficiency and 1.1 cm2/V-s electron mobility for low-temperature substrates Chang-Hong Shen; Jia-Min Shieh; Hao-Chung Kuo ... 2010 International Electron Devices Meeting, 2010-Dec. Conference Proceeding For the first time, we report a low temperature silicon thin film deposition technology using high density plasma for high performance and low cost solar cells with embedded transistor modules. For ...	Full text Entire journal
64.	Laser ablative chemical etching of silicon dioxide Dai, Bau-Tong 01/1987 Dissertation	Full text

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