UNI-MB - logo
UMNIK - logo
 

Search results

Basic search    Expert search   

Currently you are NOT authorised to access e-resources UM. For full access, REGISTER.

12 13 14 15
hits: 147
131.
Full text
132.
Full text
133.
Full text
134.
Full text
135.
Full text
136.
Full text
137.
Full text
138.
Full text
139.
Full text
140.
  • High-power-used thermal gel... High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests
    Tong Hong Wang; Hsuan-Yu Chen; Chang-Chi Lee ... 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009-Oct.
    Conference Proceeding

    HFCBGA is a thermally enhanced FCBGA with its heat spreader extending heat conduction area by connecting itself to the rear side of the silicon die. A thermal interface material plays an important ...
Full text
12 13 14 15
hits: 147

Load filters