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Beolé, S; Carnesecchi, F; Contin, G; de Oliveira, R; A di Mauro; Ferry, S; Hillemanns, H; Junique, A; Kluge, A; Lautner, L; Mager, M; Mehl, B; Rebane, K; Reidt, F; Sanna, I; Šuljić, M; Yüncü, A
arXiv (Cornell University), 10/2022Paper, Journal Article
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
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