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zadetkov: 297
1.
  • Warming and redistribution ... Warming and redistribution of nitrogen inputs drive an increase in terrestrial nitrous oxide emission factor
    Harris, E; Yu, L; Wang, Y-P ... Nature communications, 07/2022, Letnik: 13, Številka: 1
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    Anthropogenic nitrogen inputs cause major negative environmental impacts, including emissions of the important greenhouse gas N O. Despite their importance, shifts in terrestrial N loss pathways ...
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  • Observations of Ice Nucleat... Observations of Ice Nucleating Particles Over Southern Ocean Waters
    McCluskey, C. S.; Hill, T. C. J.; Humphries, R. S. ... Geophysical research letters, 16 November 2018, Letnik: 45, Številka: 21
    Journal Article
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    A likely important feature of the poorly understood aerosol‐cloud interactions over the Southern Ocean (SO) is the dominant role of sea spray aerosol, versus terrestrial aerosol. Ice nucleating ...
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3.
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4.
  • Analysis of encapsulation p... Analysis of encapsulation process in 3D stacked chips with different microbump array
    Ong, Ernest E.S.; Abdullah, M.Z.; Khor, C.Y. ... International communications in heat and mass transfer, 12/2012, Letnik: 39, Številka: 10
    Journal Article
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    This paper presented the study of encapsulation process in 3D stacked chips with different microbump arrays. An experiment was carried out on two-stacked chips with bumps in perimeter array, and ...
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6.
  • Improved measurement of the... Improved measurement of the reactor antineutrino flux at Daya Bay
    An, F. P.; Band, H. R.; Bishai, M. ... Physical review. D, 09/2019, Letnik: 100, Številka: 5
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    This work reports a precise measurement of the reactor antineutrino flux using 2.2 million inverse beta decay (IBD) events collected with the Daya Bay near detectors in 1230 days. The dominant ...
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7.
  • Fluid–structure interaction... Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation
    Ong, Ernest E.S.; Abdullah, M.Z.; Khor, C.Y. ... Microelectronic engineering, January 2014, 2014-1-00, 20140101, Letnik: 113
    Journal Article
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    The figure shows the FSI implications to chip deformation during plastic encapsulation. The initial and final chip deformation is displayed. •An experiment was carried out to validate the numerical ...
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8.
  • History of chemically and r... History of chemically and radiatively important atmospheric gases from the Advanced Global Atmospheric Gases Experiment (AGAGE)
    Prinn, Ronald G.; Weiss, Ray F.; Arduini, Jgor ... Earth system science data, 06/2018, Letnik: 10, Številka: 2
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    We present the organization, instrumentation, datasets, data interpretation, modeling, and accomplishments of the multinational global atmospheric measurement program AGAGE (Advanced Global ...
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9.
  • Effects of Aspect Ratio in ... Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach
    Ishak, M. H. H.; Abdullah, M. Z.; Abdul Aziz, M. S. ... Journal of Applied Fluid Mechanics, 11/2017, Letnik: 10, Številka: 6
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    The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural ...
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10.
  • FSI implications of EMC rhe... FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process
    Ong, Ernest E.S.; Abdullah, M.Z.; Loh, W.K. ... Microelectronics and reliability, 04/2013, Letnik: 53, Številka: 4
    Journal Article
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    In this paper, an efficient numerical approach has been adopted to analyze the fluid/structure interaction (FSI) implications to 3D IC with through-silicon via (TSV) structures during plastic ...
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zadetkov: 297

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