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zadetkov: 39
1.
  • Pressureless and low-temper... Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste
    Zhang, Zheng; Chen, Chuantong; Suetake, Aiji ... Scripta materialia, June 2021, 2021-06-00, Letnik: 198
    Journal Article
    Recenzirano

    In this work, we applied a Ag flake formed paste for sinter-joining on bare Si, SiC, and GaN surfaces. The sintered joints possess a high shear strength of over 40 MPa under a pressureless sintering ...
Celotno besedilo
2.
  • Reliability of Ag Sinter-Jo... Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
    Zhang, Zheng; Chen, Chuantong; Suetake, Aiji ... Journal of electronic materials, 12/2021, Letnik: 50, Številka: 12
    Journal Article
    Recenzirano

    Silver (Ag) sinter-joining is an ideal connection technique for wide bandgap (WBG) power electronics packaging due to its excellent high-temperature stability and excellent thermal conductivity. In ...
Celotno besedilo
3.
  • Interface reaction and evol... Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
    Chen, Chuantong; Zhang, Zheng; Kim, Dongjin ... Journal of alloys and compounds, 05/2021, Letnik: 862
    Journal Article
    Recenzirano

    The fracture behaviors and Ag–Au joint interface evolution of sintered micron-sized Ag particles paste joined on an electroless nickel/electroless palladium/immersion gold (ENEPIG)-plated ...
Celotno besedilo
4.
  • Interface regulation of mic... Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
    Huo, Fupeng; Chen, Chuantong; Zhang, Zheng ... Materials & design, April 2024, 2024-04-00, 2024-04-01, Letnik: 240
    Journal Article
    Recenzirano
    Odprti dostop

    Display omitted •Ultrafine Ag nanoparticles ejection phenomenon of micron Ag flake is observed for the first time by in-situ TEM.•In-situ surface modification of Al particles in sintered Ag-Al ...
Celotno besedilo
5.
  • Development of thermal shoc... Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
    Kim, Dongjin; Chen, Chuantong; Suetake, Aiji ... Microelectronics and reliability, September 2018, 2018-09-00, Letnik: 88-90
    Journal Article
    Recenzirano
    Odprti dostop

    GaN die-attach/DBC substrate joint structure bonded by Ag sinter paste/W thin film/Ag sinter paste sandwich die-attached layer was designed and its high-temperature reliability was investigated. GaN ...
Celotno besedilo
6.
  • Design of Ni-rGO reinforced... Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
    Huo, Fupeng; Chen, Chuantong; Zhang, Zheng ... Journal of materials research and technology, July-August 2024, Letnik: 31
    Journal Article
    Recenzirano
    Odprti dostop

    Based on the principles of micro-alloying and composite, the graphene reinforced Sn2.5Ag0.7Cu0.1Ce composite solder was designed. Ni nanoparticle-modified reduced graphene oxide (Ni-rGO) was prepared ...
Celotno besedilo
7.
  • Fabrication and Characteriz... Fabrication and Characterization of Ultra‐Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting
    Ekubaru, Yusufu; Sugahara, Tohru; Ibano, Kenzo ... Advanced materials technologies, 20/May , Letnik: 5, Številka: 5
    Journal Article
    Recenzirano

    Thermoelectric generators (TEGs) are a promising power source for realizing a self‐powered sensor, which is a primary component of the rapidly developing Internet of Things. Here, the fabrication of ...
Celotno besedilo

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8.
  • Online Thermal Resistance a... Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
    Kim, Dongjin; Nagao, Shijo; Chen, Chuantong ... IEEE transactions on power electronics 36, Številka: 5
    Journal Article
    Recenzirano

    Despite the rapid progression of silicon carbide (SiC) power devices, the thermal characteristic evaluation during power cycling at high temperature (>200 °C) is an issue. In this article, a fast and ...
Celotno besedilo
9.
Celotno besedilo
10.
  • Online Condition Monitoring... Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique
    Zhang, Zheng; Chen, Chuantong; Suetake, Aiji ... IEEE transactions on power electronics, 2023-Feb., 2023-2-00, Letnik: 38, Številka: 2
    Journal Article
    Recenzirano

    In this work, an acoustic emission (AE) technique was applied to online condition monitoring (CM) of solder fatigue in a clip-bonding SiC mosfet power assembly during short and long power cycling ...
Celotno besedilo
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zadetkov: 39

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