Tungsten and tungsten alloys show the typical change in fracture behavior from brittle at low temperatures to ductile at high temperatures. In order to improve the understanding of the effect of microstructure the fracture toughness of pure tungsten, potassium doped tungsten, tungsten with 1 wt.% La 2O 3 and tungsten rhenium alloys were investigated by means of 3-point bending, double cantilever beam and compact tension specimens. All these materials show the expected increase in fracture toughness with increasing temperature. The experiments demonstrate that grain size, texture, chemical composition, grain boundary segregation and dislocation density seem to have a large effect on fracture toughness below the DBTT. These influences can be seen in the fracture behavior and morphology, where two kinds of fracture occur: on the one hand transgranular and on the other hand intergranular fracture. Therefore, techniques like electron backscatter diffraction (EBSD), Auger electron spectroscopy (AES) and X-ray line profile analysis were used to improve the understanding of the parameters influencing fracture toughness.