E-viri
Recenzirano
-
KANG, Jeung-Mo; CHOI, Jeong-Hyeon; KIM, Du-Hyun; KIM, Jae-Wook; SONG, Yong-Seon; KIM, Geun-Ho; HAN, Sang-Kook
IEEE electron device letters, 10/2008, Letnik: 29, Številka: 10Journal Article
Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.
