Abstract We report the growth of bulk β-Ga 2 O 3 crystals based on crystal pulling from a melt using a cold container without employing a precious-metal crucible. Our approach, named oxide crystal growth from cold crucible (OCCC), is a fusion between the skull-melting and Czochralski methods. The absence of an expensive precious-metal crucible makes this a cost-effective crystal growth method, which is a critical factor in the semiconductor industry. An original construction 0.4–0.5 MHz SiC MOSFET transistor generator with power up to 35 kW was used to successfully grow bulk β-Ga 2 O 3 crystals with diameters up to 46 mm. Also, an original diameter control system by generator frequency change was applied. In this preliminary study, the full width at half maximum of the X-ray rocking curve from the obtained β-Ga 2 O 3 crystals with diameters ≤ 46 mm was comparable to those of β-Ga 2 O 3 produced by edge-defined film fed growth. Moreover, as expected, the purity of the obtained crystals was high because only raw material-derived impurities were detected, and contamination from the process, such as insulation and noble metals, was below the detection limit. Our results indicate that the OCCC technique can be used to produce high-purity bulk β-Ga 2 O 3 single crystalline substrate.