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  • Device and Integration Tech...
    Hyundai Park; Sysak, M N; Hui-Wen Chen; Fang, A W; Di Liang; Ling Liao; Koch, B R; Bovington, J; Yongbo Tang; Wong, K; Jacob-Mitos, M; Jones, R; Bowers, J E

    IEEE journal of selected topics in quantum electronics, 05/2011, Letnik: 17, Številka: 3
    Journal Article

    The device and integration technology for silicon photonic transmitters are reviewed in this paper. The hybrid silicon platform enables on-chip lasers to be fabricated with silicon photonic circuits and can be integrated in the CMOS back-end flow. Laser arrays from multiple die bonding and quantum well intermixing techniques are demonstrated to extend the spectral bandwidth from the laser array of the transmitter. Two modulator technologies, silicon modulators and hybrid silicon modulators, are also described.