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Ramdani, M.; Sicard, E.; Boyer, A.; Ben Dhia, S.; Whalen, J.J.; Hubing, T.H.; Coenen, M.; Wada, O.
IEEE Transactions on Electromagnetic Compatibility, 02/2009, Letnik: 51, Številka: 1Book Review, Journal Article
Throughout the decades of continuous advances in semiconductor technology, from the discrete devices of the late 1950s to today's billon-transistor system-on-chip, there have always been concerns about the ability of components to operate safely in an increasingly disruptive electromagnetic environment. This paper provides a nonexhaustive review of the research work conducted in the field of electromagnetic compatibility (EMC) at the IC level over the past 40 years. It also brings together a collection of information and trends in IC technology, in order to build a tentative roadmap for the EMC of ICs until the year 2020, with a focus on measurement methods and modeling approaches.
