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Feng, Hsien-Ping; Paudel, Trilochan; Yu, Bo; Chen, Shuo; Ren, Zhi Feng; Chen, Gang
Advanced materials (Weinheim), June 3, 2011, Letnik: 23, Številka: 21Journal Article
Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles.
