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  • Diffusion of Adhesion Layer...
    Yang, J. Joshua; Strachan, John Paul; Xia, Qiangfei; Ohlberg, Douglas A. A.; Kuekes, Philip J.; Kelley, Ronald D.; Stickle, William F.; Stewart, Duncan R.; Medeiros-Ribeiro, Gilberto; Williams, R. Stanley

    Advanced materials (Weinheim), September 22, 2010, Letnik: 22, Številka: 36
    Journal Article

    Thermal diffusion of Ti through Pt electrode forms Ti atom channels of 1 nm diameter along Pt grain boundaries, seeding switching centers and controlling nanoscale memristive switching. The image shows EFTEM maps of Ti overlaid on HRTEM images for a Si/SiO2 100 nm/Ti 5nm/Pt 15 nm sample in‐situ annealed in ultrahigh vacuum at 250 °C for 1 hour.