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Yamada, Y.; Hasegawa, K.; Ikeda, Y.; Kasagi, Y.; Katagiri, K.; Katou, H.; Watanabe, H.; Takenaka, A.; Nagata, H.; Sekine, N.; Sano, Y.
Microelectronics and reliability, September 2019, 2019-09-00, Letnik: 100-101Journal Article
Novel pressure-free Cu nanoparticle joints for power electronic devices were fabricated, and their reliability was investigated. Si heater chips were bonded to Cu-65Mo baseplates without applied pressure in a N2 atmosphere. The increase in thermal resistance was found to be less than 30% after 1000 thermal cycles of −40/150 °C and −40/200 °C. Samples with Ag- or Cu-coated baseplates showed no deterioration following 3000 power cycles of 65/250 °C. In contrast, samples with baseplates coated with Au or Ni exhibited an increase in thermal resistance in power cycle tests of 65/200 °C and 65/250 °C.
