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Pan, Xinlei; Zhou, Liucheng; Wang, Chenxi; Yu, Kun; Zhu, Yiqi; Yi, Min; Wang, Lingfeng; Wen, Shifeng; He, Weifeng; Liang, Xiaoqing
International journal of machine tools & manufacture, January 2023, 2023-01-00, Letnik: 184Journal Article
Laser shock peening (LSP) is an advanced surface-strengthening technology that improves the anti-fatigue performance of metallic components. However, there is a significant barrier to the application of thin-walled components because the high-energy laser causes deformation and nonuniformity of compressive residual stress, thereby reducing fatigue performance. In this study, an LSP technology based on a low-pulse-energy laser was developed. We applied it to a thin-walled AA7075 aluminium alloy specimen (∼4 mm thickness) and achieved an improvement in the high-cycle fatigue limit of 20.4 and 37.0% for the smooth and pre-cracked fatigue specimens, respectively, in the absence of deformation. It was discovered that the enhanced dynamic nanoscale precipitation and dislocation multiplication effects of the high-pressure shock wave contribute to microstructure stability under cyclic loading, resulting in high compressive residual stress stability. Moreover, the unique heterogeneous grain structure on the surface layer subjected to LSP at low pulse energy effectively restrains crack initiation and propagation. Because these findings apply to a wide range of alloys, the current results create new avenues for improving the fatigue performance of thin-walled components. Display omitted •Laser shock peening at a low pulse energy can improve the fatigue strength of thin-walled parts.•More nanoprecipitations are formed because of the intensified dynamic precipitation effects.•Heterogeneous grain structure are introduced into the materials.•Molecular dynamic simulation is conducted to understand non-uniform grain refinement phenomenon.
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Dostop do baze podatkov JCR je dovoljen samo uporabnikom iz Slovenije. Vaš trenutni IP-naslov ni na seznamu dovoljenih za dostop, zato je potrebna avtentikacija z ustreznim računom AAI.
Leto | Faktor vpliva | Izdaja | Kategorija | Razvrstitev | ||||
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JCR | SNIP | JCR | SNIP | JCR | SNIP | JCR | SNIP |
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in: SICRIS
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