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Solder Joint Technology [Elektronski vir] : Materials, Properties, and ReliabilityType of material - e-book ; adult, seriousPublication and manufacture - New York : Springer, 2007Language - englishISBN - 978-0-387-38892-2COBISS.SI-ID - 32519173
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SpringerLink e-books 2005-2007Celotno besedilo dostopno za uporabnike SpringerLink slovenskega konzorcija neprofitnih institucij: UL, UM, UNG, UP, KI, IJS, OILJ, ZRC SAZU, SBCE, UKCMB, KIS.
Full text accessible to the users of SpringerLink Slovenian Consortium of Non-Profit Institutions UL, UM, UNG, UP, KI, IJS, OILJ, ZRC SAZU, SBCE, UKCMB, KIS.
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Other authors
Tu, King-Ning |
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Collection
Springer Series in Materials Science
Topics
Electronics |
Machinery |
Materials |
Optical materials |
System safety |
Chemistry |
Electronics and Microelectronics, Instrumentation |
Manufacturing, Machines, Tools |
Metallic Materials |
Optical and Electronic Materials |
Quality Control, Reliability, Safety and Risk
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