The fabrication of high‐resolution patterns on flexible substrates is an essential step in the development of flexible electronics. However, the patterning process on flexible substrates often requires expensive equipment and tedious lithographic processing. Here, a bottom‐up patterning technique, termed electrochemical replication and transfer (ERT) is reported, which fabricates multiscale patterns of a wide variety of materials by selective electrodeposition of target materials on a predefined template, and subsequent transfer of the electrodeposited materials to a flexible substrate, while leaving the undamaged template for reuse for over 100 times. The additive and parallel patterning attribute of ERT allows the fabrication of multiscale patterns with resolutions spanning from sub‐100 nm to many centimeters simultaneously, which overcomes the trade‐off between resolution and throughput of conventional patterning techniques. ERT is suitable for fabricating a wide variety of materials including metals, semiconductors, metal oxides, and polymers into arbitrary shapes on flexible substrates at a very low cost. A new additive patterning technique, named electrochemical replication and transfer, is developed to pattern a wide variety of metals, semiconductors, and polymers with resolutions spanning from sub‐100 nm to many centimeters on flexible substrates at low cost and high throughput.