It is foreseen to significantly increase the luminosity of the Large Hadron Collider (LHC) at CERN around 2018 by upgrading the LHC towards the SLHC (Super-LHC). Due to the radiation damage to the ...silicon detectors used, the physics experiments will require new tracking detectors for SLHC operation. All-silicon central trackers are being studied in ATLAS, CMS and LHCb, with extremely radiation hard silicon sensors for the innermost layers. The radiation hardness of these new sensors must surpass the one of LHC detectors by roughly one order of magnitude. Within the CERN RD50 collaboration, a massive R&D program is underway to develop silicon sensors with sufficient radiation tolerance.
We will report on recent results obtained by RD50 from tests of several detector technologies and silicon materials at radiation levels corresponding to SLHC fluences. Based on these results, we will give recommendations for the silicon detector technologies to be used at the different radii of SLHC tracking systems.
The tracking system of the CMS experiment at the LHC collider (CERN) is based on silicon micro-strip detectors. They will be exposed to an equivalent fluence of up to 1.6×1014n(1MeV)/cm2 during 10 ...years of operation. The survival of the sensors in such a radiation environment depends strongly on the sensor design and on the choice of appropriate material. During production we have to verify not only the current quality of the delivered sensors (optical and electronic inspection) but also their radiation hardness. After irradiation to the exposed fluence plus a safety factor, the quality of bulk and surface parameters is verified. Required protocol, measurements and results are presented.
The CMS experiment at the LHC, CERN, will operate the largest tracker in the world entirely made of silicon detectors. The collaboration is facing the quality assurance work to prove the reliability ...and performance of the various parts produced by industry. A status report on the CMS Tracker is given, including the validation of single modules up to larger integrated substructures
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