The RD50-CMOS group aims to design and study High Voltage CMOS (HV-CMOS) chips for use in a high radiation environment. Currently, measurements are performed on RD50-MPW2 chip, the second prototype ...developed by this group. The active matrix of the prototype consists of 8x8 pixels with analog front end. Details of the analog front end and simulations have been already published earlier. This contribution focuses on the Caribou based readout system of the active matrix. Each pixel of the active matrix can be readout one after the other. Relevant aspects of hardware, firmware and software are introduced. As a first stage, firmware for a standalone setup is introduced and details on data flow are given. Afterwards, a second stage of the firmware capable of synchronizing with other detectors and accepting triggers is presented, focusing on operation of the chip in combination with a tracking telescope to measure efficiency and residuals.
The DMAPS upgrade of the Belle II vertex detector Babeluk, M.; Barbero, M.; Baudot, J. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
07/2024, Letnik:
1064
Journal Article
Recenzirano
The Belle II experiment at KEK in Japan considers an upgrade for the vertex detector system in line with the accelerator upgrade for higher luminosity at long shutdown 2 planned for 2028.
One ...proposal for the upgrade of the vertex detector called VTX aims to improve background robustness and reduce occupancy using small and fast pixels. VTX accommodates the OBELIX depleted monolithic active CMOS pixel sensor (DMAPS) on all five proposed layers. OBELIX is specifically developed for the VTX application and based on the TJ-Monopix2 chip initially developed to meet the requirements of the outer layers of the ATLAS inner tracker (ITk).
This paper will review recent tests of the TJ-Monopix2 chip as well as various design aspects of the OBELIX-1 chip currently under development.
B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, ...front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure.
In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor.
This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder.
We present the concept and the assembly procedure of the Origami chip-on-sensor modules.
The Belle II Silicon Vertex Detector Friedl, M.; Ackermann, K.; Aihara, H. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
12/2013, Letnik:
732
Journal Article
Recenzirano
Odprti dostop
The KEKB machine and the Belle experiment in Tsukuba (Japan) are now undergoing an upgrade, leading to an ultimate luminosity of 8×1035cm−2s−1 in order to measure rare decays in the B system with ...high statistics.
The previous vertex detector cannot cope with this 40-fold increase of luminosity and thus needs to be replaced. Belle II will be equipped with a two-layer Pixel Detector surrounding the beam pipe, and four layers of double-sided silicon strip sensors at higher radii than the old detector. The Silicon Vertex Detector (SVD) will have a total sensitive area of 1.13m2 and 223,744 channels—twice as many as its predecessor.
All silicon sensors will be made from 150mm wafers in order to maximize their size and thus to reduce the relative contribution of the support structure. The forward part has slanted sensors of trapezoidal shape to improve the measurement precision and to minimize the amount of material as seen by particles from the vertex. Fast-shaping front-end amplifiers will be used in conjunction with an online hit time reconstruction algorithm in order to reduce the occupancy to the level of a few percent at most. A novel “Origami” chip-on-sensor scheme is used to minimize both the distance between strips and amplifier (thus reducing the electronic noise) as well as the overall material budget.
This report gives an overview on the status of the Belle II SVD and its components, including sensors, front-end detector ladders, mechanics, cooling and the readout electronics.
Performance studies on the ohmic side of silicon microstrip sensors Valentan, M.; Bergauer, T.; Dragicevic, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
12/2013, Letnik:
732
Journal Article
Recenzirano
High precision collider experiments at high energy accelerators and B-factories need accurate position resolution while preserving a low material budget for precise particle tracking. Thin ...double-sided silicon detectors (DSSDs) fulfill both requirements, if a careful sensor design is applied to maintain a high charge collection efficiency. In this continuation of a previous study we investigate the p-stop and the p-spray blocking methods for strip isolation on the n-side (ohmic side) of DSSDs with n-type bulk. We compare three different p-stop patterns: the common p-stop pattern, the atoll p-stop pattern and a combination of these patterns, and for every pattern four different geometric layouts are considered. Moreover we investigate the effect of the strip isolation on sensors with one intermediate strip. Sensors featuring these p-stop patterns and the p-spray blocking method were tested in a 120GeV/c hadron beam at the SPS at CERN, γ-irradiated to 100kGy at SCK-CEN (Mol, Belgium), and immediately afterwards tested again at CERN in the same setup as before. The results of these tests are used to optimize the design of DSSDs for the Belle II experiment at KEK (Tsukuba, Japan).
•We compare strip insulation methods on the n-side of double-sided silicon sensors.•Common, atoll, and a combined p-stop patterns, four variants each, and p-spray are studied.•Sensors are manufactured by Micron Semiconductor Ltd., with and w/o intermediate strips.•Performance in 120GeV/c hadron beam, before and after irradiation to 100kGy.•Atoll p-stop shows best overall performance, especially for intermediate strips.
The Belle experiment at the KEKB electron/positron collider in Tsukuba (Japan) was successfully running for more than ten years. A major update of the machine to SuperKEKB is now foreseen until 2015, ...aiming a peak luminosity which is 40 times the peak value of the previous system. This also requires a redesign of the Belle detector (leading to Belle II) and especially its Silicon Vertex Detector (SVD), which surrounds the beam pipe.
The future Belle II SVD will consist of four layers of double-sided silicon strip sensors based on 6in. silicon wafers. Three of the four layers will be equipped with trapezoidal sensors in the slanted forward region. Moreover, two inner layers with pixel detectors based on DEPFET technology will complement the SVD as innermost detector. Since the KEKB-factory operates at relatively low energy, material inside the active volume has to be minimized in order to reduce multiple scattering. This can be achieved by arranging the sensors in the so-called “Origami chip-on-sensor concept”, and a very light-weight mechanical support structure made from carbon fiber reinforced Airex foam. Moreover, CO2 cooling for the front-end chips will ensure high efficiency at minimum material budget.
In this paper, an overview of the future Belle II SVD design will be given, covering the silicon sensors, the readout electronics and the mechanics. A strong emphasis will be given to our R&D work on double-sided sensors where different p-stop layouts for the n-side of the detectors were compared. Moreover, this paper gives updated numbers for the mechanical dimensions of the ladders and their radii.
Analysis of beam test data by global optimization methods Frühwirth, R.; Bergauer, T.; Friedl, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
12/2013, Letnik:
732
Journal Article
Recenzirano
Successful track reconstruction in a silicon tracking device depends on the quality of the alignment, on the knowledge of the sensor resolution, and on the knowledge of the amount of material ...traversed by the particles. We describe algorithms for the concurrent estimation of alignment parameters, sensor resolutions and material thickness in the context of a beam test setup. They are based on a global optimization approach and are designed to work both with and without prior information from a reference telescope. We present results from simulated and real beam test data.
•We describe a method to estimate the resolution of detectors in a beam test.•The method is based on the global optimization of a suitable objective function.•The width of individual components of the error distribution can be estimated.•Under suitable conditions, sensor thickness (and other material) can be estimated as well.
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