With the global proliferation of 5G technology, advancing electronic interconnection technologies has become critically important. The development of high-quality electrolytic copper foils, essential ...for efficient signal transmission, has garnered considerable attention. To mitigate the "skin effect" that could impair signal transmission and to ensure robust adhesion of electrolytic copper foils to the substrate, it's necessary to roughen the copper foils. This roughening process aims to substantially enhance the peel strength of the copper foils without exceeding the bounds of acceptable roughness. An effective strategy to achieve this involves the use of additives to refine the micro-coarsened surface of the copper foils. In this context, we have explored the impact of additives such as carrageenan, guar gum, and SPS on the surface morphology, roughness, and peel strength of electrolytic copper foils. Three types of additives can improve the performance of micro-roughened copper foil. Through electrochemical tests, it was found that all three types of additives have the effect of increasing cathodic polarization. The adsorption behavior of different additives was studied through theoretical calculations. By hybriding the three additives, two micro-coarsening systems were screened to obtain the lowest roughness and the highest peel strength, respectively. At the same time, the relationship between peel strength and surface area was verified, with the larger surface area resulting in greater peel strength. Finally, the synergistic effect of the three additives on increasing cathodic polarization was verified through chronopotentiometry.
Graphical Abstract
This study explores the impact of the electroplating additive JGB the surface characteristics and peel strength of electrolytic copper foils used in printed circuit boards. Utilizing Scanning ...Electron Microscopy and Atomic Force Microscopy, we found that optimal JGB concentrations enhance the morphology and roughness of the copper foil roughening layer while maintaining high peel strength. The ideal concentration of 3 mg/L achieved an average roughness of 0.953 µm and a peel strength of 0.946 N/mm. JGB's effectiveness in inhibiting copper deposition was confirmed through cyclic voltammetry, linear sweep voltammetry, and electrochemical impedance spectroscopy. Density Functional Theory calculations and in situ infrared spectroscopy elucidated JGB's adsorption and coordination actions, which have a synergistic effect on its inhibitory performance. Further investigations with molecular dynamics simulations and finite element analysis demonstrated JGB's preferential adsorption in areas of high electric field intensity, effectively controlling the copper grain morphology in the roughening layer. This research highlights the potential of dye-type additives in improving copper foil roughening for printed circuit boards applications. Future research should explore the long-term stability and environmental impact of JGB in industrial applications, while investigating other dye-type additives may further optimize the roughening process to meet diverse printed circuit boards manufacturing needs.
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