This study explores the impact of the electroplating additive JGB the surface characteristics and peel strength of electrolytic copper foils used in printed circuit boards. Utilizing Scanning Electron Microscopy and Atomic Force Microscopy, we found that optimal JGB concentrations enhance the morphology and roughness of the copper foil roughening layer while maintaining high peel strength. The ideal concentration of 3 mg/L achieved an average roughness of 0.953 µm and a peel strength of 0.946 N/mm. JGB's effectiveness in inhibiting copper deposition was confirmed through cyclic voltammetry, linear sweep voltammetry, and electrochemical impedance spectroscopy. Density Functional Theory calculations and in situ infrared spectroscopy elucidated JGB's adsorption and coordination actions, which have a synergistic effect on its inhibitory performance. Further investigations with molecular dynamics simulations and finite element analysis demonstrated JGB's preferential adsorption in areas of high electric field intensity, effectively controlling the copper grain morphology in the roughening layer. This research highlights the potential of dye-type additives in improving copper foil roughening for printed circuit boards applications. Future research should explore the long-term stability and environmental impact of JGB in industrial applications, while investigating other dye-type additives may further optimize the roughening process to meet diverse printed circuit boards manufacturing needs. Display omitted