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  • Interfacial bond-slip behav...
    Dong, Hongying; Zhao, Yizhou; Cao, Wanlin; Chen, Xuepeng; Zhang, Jianwei

    Engineering structures, 01/2021, Letnik: 226
    Journal Article

    •Push-out tests were carried out on 13 steel-plate HSC shear wall specimens with group studs.•High-strength concrete/recycled aggregate concrete is used.•Replacement of some studs with tie bar connectors is considered.•The bond-slip constitutive relationship of specimens is given. Steel-plate-reinforced concrete composite shear walls have been widely used in high-rise and super-high-rise buildings. To improve the bond behaviour between the steel plate and high-strength concrete (HSC) in shear walls, 13 steel-plate HSC shear wall (SPHSCSW) specimens with group studs were designed for push-out tests. Specimens were constructed using HSC or high-strength recycled aggregate concrete (HSRAC). Concrete strength, concrete type, stud length-to-diameter ratio, and replacement of studs with tie bar connectors are considered. The influence of different parameters on the interfacial bond behaviour of specimens is discussed by analysing the load-slip curves, bond strength, and interface damage energy dissipation. The equations for the shearing capacity of studs and the interfacial bond-slip constitutive relationship under different connectors were obtained. Results show that the influence of concrete strength on the bond strength of SPHSCSWs is positively correlated, and the bond behaviour with HSRAC is similar to that of normal HSC. When the stud length-to-diameter ratio exceeds four, increasing the ratio has little effect on improving the shearing capacity, and a further increase reduces the residual bond strength. Replacing some studs with tie bars can significantly improve the residual bond strength and interfacial bond energy dissipation capacity. The proposed equations for the shearing capacity of studs in SPHSCSWs and the bond-slip constitutive relationship agree well with the test results, which can be used for engineering applications and further research.