UP - logo
E-viri
Recenzirano Odprti dostop
  • Test beam results of 3D sil...
    Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C.; Capua, M.; Cavalli-Sforza, M.; Cobal, M.; Cristofoli, A.; Dalla Betta, G.-F.; Darbo, G.; Da Vià, C.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dobos, D.; Einsweiler, K.; Esseni, D.; Fazio, S.; Fleta, C.; Freestone, J.; Gallrapp, C.; Garcia-Sciveres, M.; Gariano, G.; Gemme, C.; Giordani, M.-P.; Gjersdal, H.; Grinstein, S.; Hansen, T.; Hansen, T.-E.; Hansson, P.; Hasi, J.; Helle, K.; Hoeferkamp, M.; Hügging, F.; Jackson, P.; Jakobs, K.; Kalliopuska, J.; Karagounis, M.; Kenney, C.; Köhler, M.; Kocian, M.; Kok, A.; Kolya, S.; Korokolov, I.; Kostyukhin, V.; Krüger, H.; La Rosa, A.; Lai, C.H.; Lietaer, N.; Lozano, M.; Mastroberardino, A.; Micelli, A.; Nellist, C.; Oja, A.; Oshea, V.; Padilla, C.; Palestri, P.; Parker, S.; Parzefall, U.; Pater, J.; Pellegrini, G.; Pernegger, H.; Piemonte, C.; Pospisil, S.; Povoli, M.; Roe, S.; Rohne, O.; Ronchin, S.; Rovani, A.; Ruscino, E.; Sandaker, H.; Seidel, S.; Selmi, L.; Silverstein, D.; Sjøbæk, K.; Slavicek, T.; Stapnes, S.; Stugu, B.; Stupak, J.; Su, D.; Susinno, G.; Thompson, R.; Tsung, J.-W.; Tsybychev, D.; Watts, S.J.; Wermes, N.; Young, C.; Zorzi, N.

    Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 05/2011, Letnik: 638, Številka: 1
    Journal Article

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.